UV-Resistant Black Hot Melt Adhesive for Low Pressure Molding and Industrial Encapsulation

Infinity IM-PA-6208-BLACK is a black thermoplastic polyamide-based hot melt adhesive developed for Low Pressure Molding applications. Supplied in pellet form, this adhesive is designed for use in hot melt application systems where durability, flexibility, and UV resistance are required. IM-PA-6208-BLACK offers fast bonding performance, strong mechanical properties, and dependable thermal stability for demanding industrial and electronic component protection.

Benefits of PA 6208 Black Hot Melt Adhesive

• Black Polyamide Hot Melt Adhesive: Ideal for applications requiring a dark, UV-stable adhesive
  
• Low Pressure Molding Compatible: Designed for encapsulation and protective molding processes
  
• UV Resistant Performance: Suitable for exposed or outdoor-use components
  
• Wide Application Temperature Range: Applies efficiently at 356–392°F (180–200°C)
  
• Fast Open Time: 1–4 seconds supports high-speed production
  
• Strong and Flexible Bonds: High tensile strength with excellent elongation

Specifications

• Series: PA-6208
  
• Product Chemistry: Polyamide
  
• Product Form: Pellets
  
• Color: Black
  
• Application Temperature: 356–392°F (180–200°C)
  
• Open Time: 1–4 seconds
  
• Viscosity: 3,000–5,500 cPs @ 392°F (200°C)
  
• Softening Point (Ring & Ball ASTM D36): 302 ±9°F (150 ±5°C)
  
• Creep Resistance: 266–275°F (130–135°C)
  
• Low Temperature Flexibility (ASTM D3111): -31°F (-35°C)
  
• Glass Transition Temperature (Tg): -44°F (-42°C)
  
• Tensile Strength (ISO 527): ≥450 psi (≥3.1 MPa)
  
• Elongation at Break (ISO 527): ≥102%
  
• Shore A Hardness: 85 ±5
  
• Specific Gravity: 0.98 g/cc (≈8.2 lb/gal)
  
• Volume Resistivity (Ohm-cm): 2.3 × 10¹¹
  
• Dielectric Strength: 24.0